直流電源
Photo of Pinnacle Plus+ DC power system
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Pinnacle® Plus+

Advanced Energy (AE) 的 Pinnacle® Plus+ 電源為單一的波形因數,為您的反應製程提供脈衝直流電解決方案所有優點,包括使用簡單、節約成本以及具有絕佳的靈活性。結合標準直流電技術和經過製程證明的脈衝直流電技術,Pinnacle Plus+ 電源與複雜而昂貴的交流電解決方案相比,沉積率更高,重複性能更好,與複雜且昂貴的AC電源解決方案相比,薄膜品質更為優異。

優點 特性
  • 更高的沉積率與產品率 
  • 薄膜均勻性和品質一流 
  • 電弧造成的基板損壞減少 
  • 成本更低 
  • 系統整合容易 
  • 極佳的製程靈活性和寬容度 
  • 重複性能 
  • 在過度曲線上運行穩定 
  • 生產量更高 
  • 便於監控 
  • 無與倫比的系統靈活性
  • 緊密型封裝 
  • 頻率調節範圍為 5-350kHz 
  • 可變工作週期高達45%
  • 電壓範圍寬——單輸出寬阻抗範圍 
  • 大功率運行 
  • 基板溫度低 
  • 單輸出(5kW 和 10kW 型號)
  • 用於多反應室生產的雙輸出(5kW 型號)
  • 絕佳的電弧控制  
  • 反應性濺射閉環控制 

 

文獻下載

Pinnacle® Plus+Pulsed-DC Power Supply brochure
Pinnacle® Plus+ HALO Pulsed-DC Power Supplies
Arc Handling in RF-Superimposed DC Processes (2006) application note
Signal Integrity for Vacuum Processing Systems (2003) white paper
The Evolution of Power Delivery in Reactive Silicon Sputtering (1999) white paper
Power Supplies for Pulsed Plasma Technologies: State-of-the-Art Outlook (1999) white paper
Advances in Arc-Handling in Reactive and Other Difficult Processes (2001) white paper
Introducing Power Supplies and Plasma Systems (2001) white paper
Control of the Reactive Sputtering Process Using Two Reactive Gases, May 2003 magazine reprint
Integrated Process Control for Reactive Sputter Deposition of Dielectric Thin Films, May 2003 magazine reprint
Pulsed-DC Reactive Sputtering of Dielectrics: Pulsing Parameter Effects, April 2000 magazine reprint
Optical Emission Studies for the Characterization of Pulsed Magnetron Sputtering Systems, April 2002 magazine reprint
Parameter Optimization in Pulsed DC Reactive Sputter Deposition of Aluminum Oxide, April 2002 magazine reprint
Substrate Response During Dual Bipolar Pulsed Magnetron Sputtering, April 2002 magazine reprint
Fabs can ride through voltage sags with power-quality targets, July 2004 magazine reprint
A Novel Frequency-Domain Small-Signal Analysis of Resonant Power Converters, July 2004 magazine reprint
Power Supplies Advance Beyond Volts and Amps, June 2003 magazine reprint
DC Sputtering Cuts Deposition Times and Costs, November 2002 magazine reprint
Enhanced Reactively Sputtered Al2O3 Deposition by Addition of Activated Reactive Oxygen, March 2001 magazine reprint
AE Global Services brochure

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